Decapped BMS Chips

I've been slowly accruing a collection of battery monitoring system (BMS) chips, each designed to monitor a stack of battery cells in a multi-cell battery pack. Other than the die area and what's in their publicly-available datasheets, I don't say much about them. I designed the secondary bandgap reference on the MAX17823.

A yellow tape measure with black millimeter marks was used to estimate die size in the following photos. The estimates are probably within about 10%. Click on any photo for a higher resolution image.

ST L9963E
		Die area: 4.34mm x 4.79mm = 20.8mm2 Channel count: 14 AEC-Q100 The orange color and what looks like a puddle... I sort of wonder whether this chip was coated in die coat, which relieves package stress and thus can improve accuracy, and whether the puddle is an artifact of the decapping chemicals interacting with the die coat.
NXP MC33771C
		Die area: 4.90mm x 4.53mm = 22.2mm2 Channel count: 14 AEC-Q100
bq79606
		Die area: 4.36mm x 4.24mm = 18.5mm2 Channel count: 6 AEC-Q100 The bq79606 went into production summer 2019.
LTC6813
		Die area: 3.61mm x 3.73mm = 13.4mm2 for the larger die Channel count: 18 AEC-Q100
LTC6811
		Die area: 3.07mm x 2.79mm = 8.6mm2 and 2.51mm x 1.01mm = 2.5mm2 Channel count: 12 AEC-Q100
MAX17823
		Die area: 4.36mm x 4.15mm = 18.1mm2 Channel count: 12 AEC-Q100
bq76pl536a
		Die area: 4.31mm x 3.85mm = 16.6mm2 Channel count: 6 Not AEC-Q100 As the Internet will tell you (ex. Jarrod on hackaday.io in comment dated 02/15/2017) this chip was used in the Tesla Model S.
bq7694003dbt
		Die area: 1.92mm x 2.29mm = 4.4mm2 per die, 13.2mm2 for all three
AD7280
		Die area: 2.32mm x 4.62mm = 10.7mm2 and 1.78mm x 2.58mm = 4.6mm2 The AD7280 is a fairly old chip, of an older generation.
ISL78600
		Die area: 3.90mm x 4.43mm = 17.2mm2 I got the ISL78600 from some sketchy Chinese web site, if I recall well.
LG
		Die area: 4.36mm x 3.80mm = 16.6mm2